Method of and an apparatus for processing a substrate

Details Method of and an apparatus for processing a substrate Method of and an apparatus for processing a substrate

1996-12-09

1999-03-30

Housel, Jamees C.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156626, 156662, 134108, 137 3, 137 88, B44C 122

Patent

active

058883444

ABSTRACT:
A substrate processing apparatus does not allow sudden boiling of supplementary liquid but rather sufficiently diffuses the supplementary liquid into processing liquid so that the temperature of the processing liquid does not decrease largely. De-ionized water (PW) is ejected through a plurality of de-ionized water blow-off openings (Ha) which are formed in a de-ionized water injection nozzle (10a). Inside an internal bath (1), which is located immediately below the de-ionized water blow-off openings, and close to a overflow part (20a) which is a top edge of a side surface (1a) of the internal bath (1), the de-ionized water reaches the surface of a phosphoric acid solution (PA). The de-ionized water thereafter reaches a gutter part (30a) of an external bath (2), as it is mixed with the phosphoric acid solution (PA), and flows into a reservoir part (30d) of the external bath (2). Since the de-ionized water (PW) never reaches inside the phosphoric acid solution (PA) within the internal bath (1), sudden boiling of the de-ionized water (PW) is prevented. The phosphoric acid solution (PA) and the de-ionized water (PW) are stirred up when the phosphoric acid solution (PA) flows over from the internal bath (1) into the external bath (2), and therefore, the de-ionized water (PW) is sufficiently diffused into the phosphoric acid solution (PA). As this does not keep the de-ionized water (PW) at the surface of the phosphoric acid solution (PA), the de-ionized water (PW) does not evaporate directly from the surface of the phosphoric acid solution (PA), a decrease in the temperature of the phosphoric acid solution (PA) is small.

REFERENCES:
patent: 4980017 (1990-12-01), Kaji et al.

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