Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate
2006-10-25
2009-10-27
Verbitsky, Gail (Department: 2855)
Thermal measuring and testing
Leak or flaw detection
With heating or cooling of specimen for test
C374S044000, C374S057000, C374S120000, C374S137000, C702S034000, C382S145000, C250S338100
Reexamination Certificate
active
07607824
ABSTRACT:
A test system and method of analyzing a pin to circuit connection on a substrate is provided. The method includes applying thermal energy to the pin or the substrate at a location outside of the pin to circuit interface, and measuring infrared radiation near the pin to circuit interface. The method also includes the step of analyzing the measured infrared radiation to determine thermal energy distribution near the pin to circuit interface resulting from thermal conductivity at the interface. The method further includes the step of determining sufficiency of the pin to circuit electrical and mechanical connection based on the determined thermal energy distribution.
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“Beat the Heat” by John Pratten III, published in EC&M at http://ecmweb.com/mag/electric—beat—heat/ on Aug. 1, 2006, 5 pages.
Chandler Brian Lee
Kuhlman Frederick F.
Delphi Technologies Inc.
Funke Jimmy L.
Verbitsky Gail
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