Method of aligning and bonding tab inner leads

Details Method of aligning and bonding tab inner leads Method of aligning and bonding tab inner leads

1988-11-01

1991-10-22

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

364477, 219 561, 219 8518, H01L 21603

Patent

active

050595598

ABSTRACT:
The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.

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