Coating processes – Coating remains adhesive or is intended to be made adhesive
Patent
1994-04-05
1995-02-21
Beck, Shrive
Coating processes
Coating remains adhesive or is intended to be made adhesive
4274121, 4274301, 4284735, B05D 510
Patent
active
053913973
ABSTRACT:
A polyimide surface (18) of a semiconductor device (12) is pretreat the polyimide layer with a hydroxyl amine solution at an elevated temperature to generate functional groups that react with an underfill encapsulant (16) to form covalent bonds between the polyimide layer and the encapsulant material between the semiconductor device and a substrate (10). The hydroxyl amine solution include a reagent such as 2,(2-aminoethoxy) ethanol dissolved in a solvent like N-methyl pyrolidione at 65.degree. C. for sixty seconds. The hydroxyl amine solution may be sprayed onto the polyimide layer, or deposited by vapor deposition. The semiconductor die with the treated polyimide layer is attached to the substrate by standard DCA methods leaving a gap between the assemblies. The encapsulant is introduced between the semiconductor die and the substrate and cured to form a covalent bond with the polyimide layer and an environmental seal between the assemblies resulting in enhanced adhesion.
REFERENCES:
patent: 4276186 (1981-06-01), Bakos et al.
patent: 5326643 (1994-07-01), Adamopoulos et al.
Atkins Robert D.
Beck Shrive
Cameron Erma
Motorola Inc.
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