Method of adhering a pair of members

Details Method of adhering a pair of members Method of adhering a pair of members

2011-08-09

2011-08-09

Arbes, Carl (Department: 3729)

Metal working

Barrier layer or semiconductor device making

C029S825000, C029S832000, C029S833000, C029S840000, C438S612000

Reexamination Certificate

active

07993417

ABSTRACT:
A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.

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International Search Report, dated Apr. 17, 2007, issued in International Application No. PCT/KR2007/000355.

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