Method of additive circuitization of circuit boards with high ad

Details Method of additive circuitization of circuit boards with high ad Method of additive circuitization of circuit boards with high ad

1991-02-14

1992-11-24

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430311, 430313, 205125, 205159, 205205, 205210, 205211, B05D 300, G03C 500

Patent

active

051660377

ABSTRACT:
Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing, imaging, developing the photoresist for additive circuitization, and forming a pattern of copper circuitization on the so exposed portions of the package. In order to avoid the formation of deleterious air bubbles on the exposed walls of the imaged and developed resist, the panel is exposed to and wetted by a liquid mist.

REFERENCES:
patent: 4268536 (1981-05-01), Beckenbaugh
patent: 4576685 (1986-03-01), Goffredo
IBM TDB "Method for Through Hole Plating Void Elimination", J. V. Pridans and C. M. Sekora, vol. 21, No. 6, Nov. 1978.
Hitachi, JA Kokai 60-217695, Electroless Plated Printed Circuit Board Manufacture.

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