Metal fusion bonding – Process – Using high frequency vibratory energy
Patent
1994-05-26
1996-02-20
Bradley, P. Austin
Metal fusion bonding
Process
Using high frequency vibratory energy
2282623, 428652, 427438, 205258, B23K 2010
Patent
active
054922631
ABSTRACT:
A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.
REFERENCES:
patent: 3129502 (1964-04-01), Olson
patent: 3875652 (1975-04-01), Arnold et al.
patent: 3953624 (1976-04-01), Arnold
patent: 4160049 (1979-07-01), Narcus
Bellus Daniel R.
Hall Gregory L.
Hearn John A.
Middleton Steven A.
Myer Ronald D.
Bradley P. Austin
Delco Electronics Corp.
Knapp Jeffrey T.
Navarre Mark A.
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