4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Ronald D. Myer

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Method for integrated circuit packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for wire bonding an aluminum wire to a lead of an electro

Metal fusion bonding – Process – Using high frequency vibratory energy
Patent

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Profile ID: LFUS-PAI-P-1411123

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