Method for wire-bonding a covered wire

Details Method for wire-bonding a covered wire Method for wire-bonding a covered wire

1996-12-05

1999-04-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438123, 2281805, H01L 2144

Patent

active

058917969

ABSTRACT:
To prevent melting and scattering of a covering-film during ball formation, the covering-film, at the time a ball is formed, has been completely removed from the portion of a covered wire which corresponds to the tail length that protrudes from the tip of a capillary.

REFERENCES:
patent: 4597522 (1986-07-01), Kibayashi
patent: 4842662 (1989-06-01), Jacodi
patent: 4864514 (1989-09-01), Yamanaka
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5310702 (1994-05-01), Yoshida et al.
patent: 5370300 (1994-12-01), Okumura
patent: 5527742 (1996-06-01), Weiler et al.

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