Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices
Patent
1999-03-24
2000-10-31
Anderson, Bruce C.
Radiant energy
Irradiation of objects or material
Irradiation of semiconductor devices
25049221, 20419234, 438712, H01J 3730
Patent
active
061406554
ABSTRACT:
Water vapor enhanced focused particle beam machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminum. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.
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Griffis Dieter P.
Russell Phillip E.
Shedd Gordon M.
Stark Terrance J.
Vitarelli James
Anderson Bruce C.
North Carolina State University
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