Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1995-04-13
1999-09-28
Tung, T.
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
216 49, 216 66, 216 72, 216 77, 216 79, 438738, H01L 2102
Patent
active
059587997
ABSTRACT:
Water vapor enhanced focused particle beam machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminum. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.
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Griffis Dieter P.
Russell Phillip E.
Shedd Gordon M.
Stark Terrance J.
Vitarelli James
North Carolina State University
Tung T.
LandOfFree
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