Method for wafer carrier cleaning

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

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134 10, 134 37, B08B 312, B08B 704

Patent

active

056980388

ABSTRACT:
A method for cleaning a wafer carrier. A tank having sides and a bottom is provided. A weir is provided within the tank and having sides lower than the sides of the tank. Nozzles for outputting pressurized solution are provided within the weir. Laminar flow jets are also provided within the weir and are coupled to a pump for providing the laminar flow. To clean a wafer carrier, the carrier is placed within the weir. Solution is directed into the grooves of the wafer carrier using the nozzles. After the wafer carrier is cleaned using the nozzles, the nozzles are turned off. The laminar flow jets are activated using the laminar flow pump to provide a vertical laminar flow. This flow carries particles released from the wafer carrier by the pressurized solution upwards and over the weir. After a predetermined time period the cleaned wafer carrier is removed from the weir. Megasonic energy may be applied during the cleaning process to further enhance the removal of particles from the wafer carrier.

REFERENCES:
patent: 4209342 (1980-06-01), Workman
patent: 4940494 (1990-07-01), Petit et al.
patent: 4980300 (1990-12-01), Miyashita et al.
patent: 5071488 (1991-12-01), Takayama et al.
patent: 5090432 (1992-02-01), Bran
patent: 5113882 (1992-05-01), Gileta
patent: 5427622 (1995-06-01), Stanasolovich et al.

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