Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-09-05
1988-07-12
Doll, John
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156613, 156614, 156DIG70, 252 6236A, C30B 2512, C30B 2522
Patent
active
047567929
ABSTRACT:
In a GaAs epitaxial wafer including, for example, two epitaxial layers having high and low carrier concentrations, the carrier concentration of the low carrier concentration layer is liable to greatly vary, so that wafers suitable for FETs and Schottky barrier diodes operated at UHF and SHF are produced at only a low yield. This drawback is eliminated by adjusting the heating temperature of GaAs substrate to 690.degree. to 730.degree. C. during the growth of the low carrier concentration layer.
REFERENCES:
patent: 3762945 (1973-10-01), DiLorenzo
patent: 3836408 (1974-09-01), Kasano
patent: 3904449 (1975-09-01), DiLorenzo et al.
patent: 3925119 (1975-12-01), Philbrick et al.
patent: 4407694 (1983-10-01), Eu et al.
patent: 4419179 (1983-12-01), Nogami
Fujita Hisanori
Kanayama Masaaki
Doll John
Kunemund Robert M.
Mitsubishi Chemical Inds. Ltd.
Mitsubishi Monsanto Chemical Co., Ltd.
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