Method for using gel package structure enhancing thermal...

Details Method for using gel package structure enhancing thermal... Method for using gel package structure enhancing thermal...

2005-09-26

2008-03-18

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000, C438S109000, C257S678000, C257S684000, C257S686000, C257S687000, C257SE23001, C257SE23107, C257SE21499

Reexamination Certificate

active

07344919

ABSTRACT:
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

REFERENCES:
patent: 6770967 (2004-08-01), Barcley
patent: 2002/0196085 (2002-12-01), Nakamata et al.

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