Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2000-06-22
2002-03-12
Sells, James (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S073100, C228S110100
Reexamination Certificate
active
06355122
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates to a method for manufacturing and inspecting a disk drive head gimbal assembly (hereafter referred to as an HG assembly), and in particular to a method for forming and inspecting a joint on an HG assembly slider terminal and head lead.
2. Description of the Related Art
Referring now to
FIG. 27
, a conventional ultrasonic connection between a slider
180
and a lead
182
is shown. A bonding pad
181
on a front end plane
180
a
of slider
180
is ultrasonically connected to lead
182
. A wedge
183
on an ultrasonic bonder (not shown) presses the elements in the direction of arrow S as ultrasonic vibrations are applied to bonding pad
181
and lead
182
in the directions of arrows T and U.
The front end
182
a
of lead
182
is adjacent to bonding pad
181
. The front end of wedge
183
is pointed in order to concentrate vibration energy on the joint.
The front-end plane
183
a
of the wedge
183
and the front-end plane
180
a
of the slider
180
are kept almost parallel by a not-illustrated connector.
Moreover, to perform ultrasonic connection, the left-side plane
180
b
of the slider
180
is brought into contact with a position controller
188
and a holder
187
for holding the slider
180
is normally pressed by a flat spring from the right of the holder
187
through a suspender
189
to press the slider
180
against the position controller
188
and fix it.
FIG. 28
is an illustration for explaining a method for inspecting a deformed shape of the lead
182
after connected and a joint. The ultrasonic-connected lead
182
is held by a damper
185
held by a pulling inspection jig
184
nearby the joint and pulled in the right top direction (direction of arrow V) in the drawing. Thereby, the lead
182
is broken or the joint is separated and the connected state is checked while referring to the then tension.
SUMMARY OF THE INVENTION
A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.
When ultrasonic-connecting a plurality of bonding pads formed on a slider integrally fixed to a flexure accessible to the recording plane of a disk of a disk drive with a plurality of leads which are fixed to at least the platform of the flexure and whose joints are formed so as to respectively face each of the bonding pad, the side plane of a wedge working on the joints of the leads facing the platform is not tapered in order to perform ultrasonic connection by pressing the joints of the leads against the faced bonding pads.
When ultrasonic-connecting a plurality of bonding pads formed on a slider held by a slider holder accessible to the recording plane of a disk of a disk drive through elastic means with a plurality of leads which is held by the slider holder and whose joints are formed so as to respectively face each of the faced bonding pads, front ends of the leads are arranged so as to be located outside of the range of the bonding pads.
When ultrasonic-connecting a plurality of bonding pads formed on a slider held by a slider holder accessible to the recording plane of a disk of a disk drive through an elastic body with a plurality of leads whose joints are formed so as to respectively face each of the bonding pads, movement of the slider in the vibrational direction is fixed by a position controller for controlling the position of the slider at least one side of the vibrational direction under ultrasonic connection and a working unit for pressing the slider against the controller by directly working on the slider from the other side of the vibrational direction.
When ultrasonic-connecting a plurality of bonding pads formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk of a disk drive with a plurality of leads which is held by the slider holder and whose joints are formed so as to respectively face each of the bonding pads, movement of a wedge working on the joints of the leads is monitored in order to perform ultrasonic connection by pressing the joints against the faced bonding pads to stop the ultrasonic connection in accordance with the movement information showing the movement of the wedge. When inspecting a slider in which a plurality of bonding pads formed on the slider held by a slider holder accessible to the recording plane of a disk of a disk drive is ultrasonic-connected with a plurality of leads which is held by the slider holder and whose joints are formed so as to respectively face each of the bonding pads when inspecting the joints between the slider and the leads, a connected state is inspected by pressing a pushpin against vicinities of the ultrasonic-connected joints of the leads.
REFERENCES:
patent: 3608809 (1971-09-01), Cushman
patent: 4142662 (1979-03-01), Holbrook et al.
patent: 4341574 (1982-07-01), Landes
patent: 4842662 (1989-06-01), Jacobi
patent: 5843255 (1998-12-01), Matsui et al.
patent: 6296171 (2001-10-01), Hembree et al.
Ichimura Yohtaroh
Itoh Kenji
Kurosu Naoki
Yoshida Tatsushi
Bracewell & Patterson L.L.P.
Martin Robert B.
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