Method for treating whole kernels of feed grain

Details Method for treating whole kernels of feed grain Method for treating whole kernels of feed grain

1974-10-15

1976-06-08

Jones, Raymond N.

Food or edible material: processes, compositions, and products

Products per se, or processes of preparing or treating...

With biocide or biostat

426460, 426462, 426482, 426507, A23L 300

Patent

active

039624790

ABSTRACT:
The disclosure relates to a method and apparatus for perforating the shells or husks of whole kernel feed grains such as shelled corn, grain sorghum, millet and the like, without shattering the kernels or destroying the germ, so that the moisture content of the treated grain can be rapidly altered.
The method comprises the steps of wetting the exterior of the kernels with water to partially plasticize the husk, treating the kernels so that the husks separate partially from the interior portion of the kernels in the form of blisters and then perforating the blisters. The treated kernels may then be subjected to other steps to attain a desired result.
Such steps may comprise heating the kernels to dry the grain for storage, wetting the grain to increase its moisture content preliminary to feeding it to animals; wetting it with liquid food supplements, antibiotics, etc., wetting it preparatory to controlled fermentation of the grain and the like.

REFERENCES:
patent: 1187703 (1916-06-01), Boss
patent: 2355810 (1944-08-01), Loewy
patent: 2412153 (1946-12-01), Huzenlaub
patent: 2438939 (1948-04-01), Ozai-Durrani
patent: 3851085 (1974-11-01), Rodgers et al.

Affiliated with

Also associated with

Rating

Method for treating whole kernels of feed grain does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for treating whole kernels of feed grain, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for treating whole kernels of feed grain will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1100966