Cleaning and liquid contact with solids – Processes – Including use of vacuum – suction – or inert atmosphere
Patent
1998-02-05
2000-07-18
El-Arini, Zeinab
Cleaning and liquid contact with solids
Processes
Including use of vacuum, suction, or inert atmosphere
134 254, 134902, 134 37, 134 32, B08B 102, B08B 504
Patent
active
060902205
ABSTRACT:
A method for transferring a wafer alternately uses a gas providing device and a vacuum generating device. The method includes decontaminating a wafer by contacting a wafer supporter having a wafer provided thereon with a positive pressure mediated stream of gas provided from suction cups of a transferring assembly, where the suction cups are connected to the gas providing device through a gas transmitting tube. After decontamination, the wafer supporter is vacuum adhered to the transferring assembly by contacting the wafer supporter with the suction cups, where the suction cups are connected to the vacuum generating device through the gas transmitting tube. Because the wafer is transferred by picking up the wafer supporter after removing waste washing solution from the wafer and wafer supporter, breakdown and performance deterioration of the transferring assembly is prevented.
REFERENCES:
patent: 5330577 (1994-07-01), Maeda et al.
patent: 5547515 (1996-08-01), Kudo et al.
patent: 5806138 (1998-09-01), Kawasaki
Jang Sam Bok
Kim Dea Won
Lee Bum Woo
Oh Kouk Jin
El-Arini Zeinab
Samsung Electronics Co,. Ltd.
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