Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-09-27
1997-07-22
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566571, 1566271, 1566541, 205123, 205221, 205223, H01L 21306
Patent
active
056500424
ABSTRACT:
In an SOI substrate having a base substrate, an insulating film and a semiconductor active layer, a potential difference is given between the base substrate and an etching solution or among the base substrate, the semiconductor active layer and the etching solution to form a uniform depletion layer on the active layer side from the interface between the insulating film and the active layer. The semiconductor active layer is uniformly thinned down by etching using a solution or by the combination of chemical or electro-chemical surface and etching with the resultant reaction product. In this case, the individual electrodes are provided with seal members to prevent the base substrate electrode and the active layer electrode from contacting the etching solution or the reaction solution due to the etching using the etching solution or the chemical reaction using the reaction solution. According to this invention, therefore, the active layer in, for example, a bonded SOI substrate can be thinned down uniformly at a low cost.
REFERENCES:
Mumola et al, "Plasma Thinned SOI Bonded Wafers", Mar. 1992, pp. 152-153, Hughes Danbury Optical Systems, Inc.
Mitani et al, "Wafer Bonding Technology for Silicon on Insulator Applications: A Review", 1992, pp. 669-676, Journal of Electronic Materials, vol. 21 No. 7.
Breneman R. Bruce
NEC Corporation
Stein Julie Ellyn
LandOfFree
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