Method for thin film formation

Details Method for thin film formation Method for thin film formation

1985-04-17

1987-04-14

Pianalto, Bernard D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 42, 4272552, B05D 306

Patent

active

046577742

ABSTRACT:
A method for forming a thin film on a substrate, which comprises aligning an evaporation means for an evaporating material to be deposited on the substrate, a plasma generating zone for dissociating an ion-forming gas into ions and electrons, an ion beam accelerating zone for accelerating the resulting ions and irradiating them onto the substrate, and said substrate on a substantially straight line in the order stated, and depositing a vapor of the evaporating material on the substrate through the plasma generating zone and the ion beam accelerating zone. According to this method, surface irradiation can be carried out uniformly because the ion species and the vapor atoms are irradiated in quite the same direction. Furthermore, the vapor atoms can be activated to a high degree, and the by-product electrons can be effectively utilized for the evaporation of the evaporant.

REFERENCES:
patent: 4098919 (1978-07-01), Morimoto et al.
patent: 4152478 (1979-05-01), Takagi
patent: 4161418 (1979-07-01), Morimoto et al.
patent: 4218495 (1980-08-01), Takagi et al.
patent: 4354909 (1982-10-01), Takagi et al.

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