Method for the treatment of substrates

Details Method for the treatment of substrates Method for the treatment of substrates

1996-12-18

1999-07-06

Bowers, Charles

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

Ionized irradiation

438711, 438727, H01L 21321

Patent

active

059207990

ABSTRACT:
The invention provides methods and apparatus for treating substrates and hazardous biological wastes. According to one exemplary method, at least one substrate is placed into a chamber and a vacuum is applied to the chamber. After the pressure within the chamber is sufficiently reduced, water vapor is introduced into the chamber and electromagnetic radiation energy is applied to produce a plasma. In one particularly preferable aspect, the chamber is allowed to reach a static condition before the water vapor is introduced. In this way, the water vapor is able to equally distribute itself throughout the volume of the chamber so that an equally distributed plasma can be produced upon application of the electromagnetic radiation energy.

REFERENCES:
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patent: 5115166 (1992-05-01), Campbell et al.
patent: 5171525 (1992-12-01), Jacob
patent: 5184046 (1993-02-01), Campbell
patent: 5200158 (1993-04-01), Jacob
patent: 5213758 (1993-05-01), Kawashima et al.
patent: 5223231 (1993-06-01), Drake
patent: 5325020 (1994-06-01), Campbell et al.

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