Abrading – Precision device or process - or with condition responsive... – Controlling temperature
Reexamination Certificate
2007-07-09
2010-10-19
Eley, Timothy V (Department: 3724)
Abrading
Precision device or process - or with condition responsive...
Controlling temperature
C451S008000, C451S053000, C451S056000, C451S057000, C451S063000, C451S261000, C451S269000
Reexamination Certificate
active
07815489
ABSTRACT:
A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling apparatus and is thereby moved on a cycloidal trajectory, wherein the semiconductor wafers are machined in material-removing fashion between two rotating working disks, wherein each working disk comprises a working layer containing bonded abrasive. The method according to the invention makes it possible, by means of specific kinematics, to produce extremely planar semiconductor wafers.
REFERENCES:
patent: 5113622 (1992-05-01), Nishiguchi et al.
patent: 5364655 (1994-11-01), Nakamura et al.
patent: 5863306 (1999-01-01), Wei et al.
patent: 6007407 (1999-12-01), Rutherford et al.
patent: 6095898 (2000-08-01), Hennhofer et al.
patent: 6179950 (2001-01-01), Zhang et al.
patent: 6257961 (2001-07-01), Suzuki et al.
patent: 6299514 (2001-10-01), Boller
patent: 6454644 (2002-09-01), Miyazaki et al.
patent: 6599177 (2003-07-01), Nevoret et al.
patent: 6645862 (2003-11-01), Wenski et al.
patent: 6793837 (2004-09-01), Wenski et al.
patent: 7101258 (2006-09-01), Ising
patent: 2003/0054650 (2003-03-01), Wenski et al.
patent: 2004/0229548 (2004-11-01), Kann et al.
patent: 2005/0276979 (2005-12-01), Slutz et al.
patent: 1610069 (2005-04-01), None
patent: 10007390 (2000-10-01), None
patent: 19954355 (2001-05-01), None
patent: 10162597 (2003-03-01), None
patent: 10344602 (2005-05-01), None
patent: 2000271857 (2000-10-01), None
patent: 02218557 (2001-08-01), None
patent: 2001219362 (2001-08-01), None
patent: 2005059175 (2005-03-01), None
patent: WO 9519242 (1995-07-01), None
patent: WO 9924218 (1995-07-01), None
Thomas Ardelt, Berichte aus dem Produktionstechnischen Zentrum Berlin, Fraunhofer Institut fur Produktionsanlagen und Konstruktionstechnik, IPK Berlin, 2001, pp. 37-53.
English Derwent Abstract AN 2005-387575 corresponds to DE 10344602A1.
English Derwent Abstract AN 2001-617985 corresponds to DE 19954355A1.
English Derwent Abstract AN 2003-231546 corresponds to DE 10162597C1.
Patent Abstracts of Japan corresponds to JP 02-218557.
Patent Abstracts of Japan corresponds to JP 2001-219362 A.
Kerstan Michael
Pietsch Georg
Spring Heiko aus dem
Brooks & Kushman P.C.
Eley Timothy V
Peter Wolters GmbH
Siltronic AG
LandOfFree
Method for the simultaneous double-side grinding of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for the simultaneous double-side grinding of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for the simultaneous double-side grinding of a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4205890