Method for the production of through holes in a laminate

Details Method for the production of through holes in a laminate Method for the production of through holes in a laminate

1975-08-26

1977-05-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156247, 156253, 156645, 156644, 156659, 156665, 204 24, 204 32R, 204 38B, 20412965, 252 792, C23F 102

Patent

active

040239985

ABSTRACT:
A method for the production of through holes in a laminate comprising an insulating base provided with a thin metal layer on at least one side, said laminate being intended for printed wiring. The method is characterized in that the thin metal layer is provided with a firmly adhering and protective foil or layer of a material being chemically different from the thin metal layer and that so-called burrs in the thin metal layer obtained during a mechanical machining of the holes are removed by dissolution whereupon the protective foil or layer can be removed.

REFERENCES:
patent: 3653997 (1972-04-01), Rothschild et al.
patent: 3719536 (1973-03-01), Rheingold et al.
patent: 3936548 (1976-02-01), Konicek

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