Method for the production of material for printed circuits

Details Method for the production of material for printed circuits Method for the production of material for printed circuits

1977-06-20

1978-10-31

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156151, 156155, 156233, 156238, 156239, 156241, 156330, 156656, 156661, 156665, 204 13, 204 15, 204 23, 204 40, 204 43R, C23F 100, C09J 506, C25D 510

Patent

active

RE0298204

ABSTRACT:
A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17.mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17.mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer.

REFERENCES:
patent: 2680699 (1954-06-01), Rubin
patent: 2721822 (1955-10-01), Pritikin
patent: 2984595 (1961-05-01), Schumpelt et al.
patent: 3203876 (1965-08-01), Deyrup
patent: 3240684 (1966-03-01), Martin et al.
patent: 3536545 (1970-10-01), Traynor et al.
patent: 3634168 (1972-01-01), Janssen et al.
patent: 3660190 (1972-05-01), Stroszynski
patent: 3672986 (1972-06-01), Schneble, Jr. et al.

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