Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2008-04-22
2008-04-22
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Plural joints
C228S256000, C228S260000
Reexamination Certificate
active
07360679
ABSTRACT:
A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece of solder material is at least partially melted off. The at least partially melted off formed piece of solder material being thrust against a bonding arrangement in such a way that both bonding partners are wetted in a bonding area to establish an electrically conductive bonding.
REFERENCES:
patent: 4828886 (1989-05-01), Hieber
patent: 5193738 (1993-03-01), Hayes
patent: 5364011 (1994-11-01), Baker et al.
patent: 5605276 (1997-02-01), Nagata
patent: 5810988 (1998-09-01), Smith, Jr. et al.
patent: 5828031 (1998-10-01), Pattanaik
patent: 6046882 (2000-04-01), Pattanaik et al.
patent: 6264090 (2001-07-01), Muntz et al.
patent: 6336581 (2002-01-01), Tuchiya et al.
patent: 6543677 (2003-04-01), Pattanaik et al.
patent: 6589594 (2003-07-01), Hembree
patent: 6595408 (2003-07-01), Cobbley et al.
patent: 6742694 (2004-06-01), Satoh et al.
patent: 2003/0070834 (2003-04-01), Tsuchiya et al.
patent: 2004/0069758 (2004-04-01), Azdasht et al.
patent: 2005/0045701 (2005-03-01), Shindo et al.
patent: 36 37 631 (1987-08-01), None
patent: 06 023 530 (1994-02-01), None
P. Kasulke et al., filed Apr. 27, 1998, Solder Bumper SB2, Electronics Manufacturing Technology.
McGlew and Tuttle , P.C.
Smart Pac GmbH - Technology Services
Stoner Kiley
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