Method for the production of a bottom resist

Details Method for the production of a bottom resist Method for the production of a bottom resist

1992-09-16

1994-11-29

Bell, Janyce

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427559, 427379, 4273855, B05D 206

Patent

active

053689011

ABSTRACT:
A method for producing a bottom resist for a two-layer O.sub.2 /Reactive Ion Etching system which fulfills all the requirements set for such a resist. A varnish layer of a base polymer containing an aromatic, a cross-linking agent and an acid-forming agent is applied to a substrate. The varnish layer is flood-exposed to release a strong acid from the acid-forming agent in the surface region of the layer. This is followed by thermal curing.

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Shaw, J. et al., "Polysiloxanes for Optical Lithography", Solid State Technology, Jun. 1987, pp. 83-89.
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Miura, S. et al., "Comparison of Silicon Containing Resist and Silylation of Imaged Resist for Multilayer Resist Lithography on a Metal Lif-Off Application", J. Electrochem. Soc., vol. 138, No. 6 (1991), pp. 1765-1769.
Reck, B. et al., "Novel Photoresist Design Based on Electrophilic Aromatic Substitution", Proc. SPE, Ellenville, N.Y. (1988), pp. 63-72, see p. 66, line 32 & 33 of the description.
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