Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-10-23
2007-10-23
Malsawma, Lex (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21579
Reexamination Certificate
active
11181574
ABSTRACT:
A method for production of an integrated circuit arrangement which contains a capacitor. A dielectric layer is structured with the aid of a two-stage etching process, and with the aid of a hard mask. In the case of an electrically insulating hard mask, the hard mask is removed again. In the case of an electrically conductive hard mask, parts of the hard mask may remain in the circuit arrangement.
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Office Action from the German Patent Office dated Oct. 2, 2003 with non-certified English translation.
Barth Hans-Joachim
Holz Jürgen
Brinks Hofer Gilson & Lione
Malsawma Lex
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