Method for the preparation of a ferroelectric substrate plate

Details Method for the preparation of a ferroelectric substrate plate Method for the preparation of a ferroelectric substrate plate

1983-04-04

1983-11-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156636, 156667, 252 793, B44C 122, C03C 1500, C03C 2506, H01L 21306

Patent

active

044128860

ABSTRACT:
The invention provides a method for surface-finishing of a single crystal wafer of a ferroelectric material into a substrate plate suitable for use, for example, as a SAW filter element which is mirror-polished only on one of the surfaces, the other surface having an adequate roughness. Different from conventional methods, the inventive method comprises the successive steps of (a) slicing a single crystal boule into wafers, (b) lapping of the wafer on both surfaces to impart adequate roughness to the surfaces, (c) chemically etching the thus lapped surfaces to remove the strain produced in the preceding mechanical working, and (d) mirror-polishing one of the thus etched surfaces so that high uniformity of the thickness and greatly decreased warping of the wafer can be ensured.

REFERENCES:
patent: 3860467 (1975-01-01), Lim
patent: 3954940 (1976-05-01), Rice et al.
patent: 4390392 (1983-06-01), Robinson et al.

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