Method for the manufacture of electronic components

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

20419215, 20429806, 20419235, 118723E, C23C 1434

Patent

active

060398493

ABSTRACT:
An apparatus (10) such as a plasma sputtering tool has a reaction chamber (11) containing a sputtering target (12) and a semiconductor substrate (13). The apparatus (10) also has a plasma ignitor (70) that is used to excite the gas molecules in the reaction chamber (11) and help generate a plasma in the reaction chamber (11). The plasma ignitor (70) has a relay (59) that is used to activate or deactivate filaments (51,52) at the appropriate times to initiate the formation of a plasma in the reaction chamber (11).

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