Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1997-10-28
2000-03-21
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419215, 20429806, 20419235, 118723E, C23C 1434
Patent
active
060398493
ABSTRACT:
An apparatus (10) such as a plasma sputtering tool has a reaction chamber (11) containing a sputtering target (12) and a semiconductor substrate (13). The apparatus (10) also has a plasma ignitor (70) that is used to excite the gas molecules in the reaction chamber (11) and help generate a plasma in the reaction chamber (11). The plasma ignitor (70) has a relay (59) that is used to activate or deactivate filaments (51,52) at the appropriate times to initiate the formation of a plasma in the reaction chamber (11).
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Fonda Arturo
Paulson Jeffrey R.
Hightower Robert F.
Mercado Julian A.
Motorola Inc.
Nguyen Nam
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