Method for the controlled melting of semiconductor bodies

Details Method for the controlled melting of semiconductor bodies Method for the controlled melting of semiconductor bodies

1978-03-20

1982-04-13

Bernstein, Hiram

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156617M, C01B 1518

Patent

active

043246109

ABSTRACT:
A method for the controlled melting of an end of a polycrystalline semiconductor body. The polycrystalline body is divided into two or more segments and the segments are positioned in a spaced apart relationship so as to be electrically isolated from each other by narrow gaps. One end of the segments is heated by an external heating means such as by induction heating to cause a portion of the end of the segments to melt. Some of the molten material so formed then flows into the gap separating the segments and electrically shorts together the segments. The opposite ends of the segments are connected to an electrical power supply and a heating current is passed through the segments and through the molten material bridging the gaps. Separately adjusting the heating effects of the external heating means and the heating current makes possible the controlled heating and controlled melting of the end portions of the segments.

REFERENCES:
patent: 840826 (1907-01-01), Colby
patent: 2961305 (1960-11-01), Dash
patent: 3360405 (1967-12-01), Keller

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