Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-02-11
1990-06-19
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29846, 156631, 156634, 156643, 156645, 156656, 1566591, 156902, B44C 122, C23F 102, C03C 1500, C03C 2506
Patent
active
049350935
ABSTRACT:
The invention provides a novel process for the mass production of thin, flexible electrical low-cost circuits. More particularly, the invention concerns the super mass production of flexible planar LC circuits, as are commercially desired as marker means in electronic article surveillance systems. The novel method provides the computerized nonstop super-mass production of such circuits and breaks down prior art barriers in view of limits for custom designs of shape, face, and resonant properties of such circuits. Custom designs of circuits are easily layouted onscreen of a modern personal computer. The data obtained thereof are downloaded to the process line. Hopping custom circuit designs with ease is unprecedentedly introduced. Forming tools have been abandoned. As an exclusive longlife production tool electromagnetic wave energy is extensively used. The circuits obtained may be washed and sewn and nicely go one way with a pretty commercial face.
REFERENCES:
patent: 2849298 (1958-08-01), Werberig
patent: 2943966 (1960-07-01), Leno et al.
patent: 3215574 (1965-11-01), Korb
patent: 3526573 (1970-09-01), Kepple et al.
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