Method for the compensation of deviations occurring as a...

Details Method for the compensation of deviations occurring as a... Method for the compensation of deviations occurring as a...

2011-05-31

2011-05-31

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

Reexamination Certificate

active

07951635

ABSTRACT:
The invention relates to a method for the compensation of deviations occurring as a result of manufacture in the manufacture of micromechanical elements and their use which should be deflected at a resonant frequency. It is therefore the object of the invention to compensate deviations which occur due to manufacture and which have an influence on the resonant frequency of micromechanical elements in a simple and cost-effective manner. In accordance with the invention, a procedure is followed such that additional trenches and/or recesses are formed at the deflectable element simultaneously with the forming of the trenches by dry etching with which at least one spring element, a deflectable element and optionally also a frame element of micromechanical elements are formed. The trenches and recesses can thereby be formed under the same respective process parameters at the respective micromechanical element or at all micromechanical elements of a batch. A removal of material during etching, preferably dry etching, therefore takes place under the same etching conditions so that the respectively removed mass at trenches and/or recesses is influenced in the same manner by the etching process parameters.

REFERENCES:
patent: 2005/0184351 (2005-08-01), Fu
patent: 691 26 381 (1997-09-01), None
patent: 198 19 458 (1999-11-01), None
patent: 101 39 443 (2003-03-01), None

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