Method for the assembly of nanowire interconnects

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C977S721000

Reexamination Certificate

active

07112525

ABSTRACT:
The present invention provides a method for the synthesis of nanowires in a silicon nanoporous template by electrodeposition and a novel technique for the integration of nanowires to transduction surfaces. In accordance with the present invention, a method for the fabrication of nanowire interconnects is provided. The method includes the steps of fabricating substantially vertical nanowires in a selectively passivated nanoporous silicon template, backetching the silicon template to expose the nanowires, eutectically bonding the exposed nanowires to a receiving silicon wafer, and etching the silicon template to produce substantially freestanding nanowire interconnects in contact with the receiving silicon wafer.

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