Method for testing standby current of semiconductor package

Details Method for testing standby current of semiconductor package Method for testing standby current of semiconductor package

2008-05-06

2008-05-06

Nguyen, Ha Tran (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S763010, C324S1540PB, C324S754090, C438S015000, C438S018000

Reexamination Certificate

active

11335270

ABSTRACT:
A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.

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English language abstract of Korean Publication No. 2000-0002076.
English language abstract of Japan Publication No. 10-090346.
English language abstract of Japan Publication No. 10-206499.

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