Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-02-22
2005-02-22
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
With measuring or testing
C438S149000, C438S199000, C438S200000, C438S201000, C438S015000, C438S286000, C438S290000, C716S030000, C714S718000, C714S719000, C714S721000, C714S724000, C714S733000, C714S734000, C714S735000
Reexamination Certificate
active
06858447
ABSTRACT:
A method for testing semiconductor chips, in particular semiconductor memory chips, is described. In which, in a chip to be tested, at least one test mode is set, the test mode is executed in the chip and test results are output from the chip. It is provided that, after the setting and before the performance of the test mode, a check mode is executed in which the status of the test mode set in the chip is read out in a defined format.
REFERENCES:
patent: 4970727 (1990-11-01), Miyawaki et al.
patent: 5202888 (1993-04-01), Ochiai
patent: 5644699 (1997-07-01), Yoshida
patent: 6233182 (2001-05-01), Satou et al.
patent: 6259639 (2001-07-01), Hashizume
patent: 6314011 (2001-11-01), Keeth et al.
patent: 6557128 (2003-04-01), Turnquist
patent: 0 786 675 (1997-04-01), None
Beer Peter
Hartmann Udo
Kallscheuer Jochen
Anya Igwe U.
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Smith Matthew
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