Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1992-03-06
1995-08-08
Nguyen, Vinh P.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
3241581, 324755, G01R 100
Patent
active
054402417
ABSTRACT:
A method for probe testing and burning-in integrated circuits formed within dice or chips on a silicon wafer and then optionally either: (1) dicing the wafer into individual chips for shipment or (2) mating the wafer for shipment with a facing substrate having a temperature coefficient of expansion (TCE) matching the TCE of the wafer. Advantageously, the facing substrate is used for both probe and burn-in operations as well as being made a part of the wafer package in option No. 2 above where either the whole silicon wafer or a partial silicon wafer meeting threshold die requirements is to be shipped. In addition, probe and burn-in operations are carried out rapidly at high yields only after all integrated circuit manufacture has been completed.
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Brooks Jerry M.
Farnworth Warren M.
King Jerrold L.
McGill George P.
Bethurum William J.
Gratton Stephen A.
Micro)n Technology, Inc.
Nguyen Vinh P.
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