Method for testing a slurry used to form a semiconductor device

Details Method for testing a slurry used to form a semiconductor device Method for testing a slurry used to form a semiconductor device

2005-10-25

2011-11-22

Rogers, David A. (Department: 2856)

Measuring and testing

Liquid analysis or analysis of the suspension of solids in a...

Content or effect of a constituent of a liquid mixture

C073S061590, C073S061620, C073S061650

Reexamination Certificate

active

08061185

ABSTRACT:
A method for forming a semiconductor device, the method includes providing a semiconductor substrate, applying a slurry to the semiconductor substrate, wherein the slurry was tested using a testing method includes taking a first undiluted sample from a top of the slurry; determining a first particle size distribution characteristic of the first undiluted sample; taking a second undiluted sample from a bottom of the slurry; determining a second particle size distribution characteristic of the second undiluted sample; and comparing a difference between the first particle size distribution characteristic and the second particle size distribution characteristics with a first predetermined value.

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