Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2007-01-16
2007-01-16
Lee, Calvin (Department: 2818)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C257S778000
Reexamination Certificate
active
11007720
ABSTRACT:
An electronic socket is described for providing either or both temporary and permanent attachments of electronic components to a substrate having interconnection circuits. The socket includes wells filled with a conductive fluid or paste for temporary attachment to the mesas of an electronic circuit. The wells are connected to selected traces of the substrate having interconnection circuits. The temporary connection may be used to produce known good die (KGD), including support of burn-in and high-speed functional test. The mesas can be filled with a material that is hardened after insertion of the mesas for permanent connection of the electronic circuit to the interconnect circuit.
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Johnson Howard
Salmon Peter C.
Dorsey & Whitney LLP
Lee Calvin
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