Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-06-30
1990-04-24
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156656, 1566591, 156665, 20419235, 252 791, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
049197487
ABSTRACT:
A method for etching metal layers including aluminum to create tapered sidewalls is disclosed. The method features the use of trifluoromethane and chlorine in controlled amounts to create a tapered metal layer profile.
REFERENCES:
patent: 4082604 (1978-04-01), Yanez
patent: 4256534 (1981-03-01), Levinstein et al.
patent: 4267013 (1981-05-01), Iida et al.
patent: 4412885 (1983-11-01), Wang et al.
patent: 4784719 (1988-11-01), Schutz
patent: 4838992 (1989-06-01), Abraham
IEDM 1986, "A1 Tapered Etching Application to Submicron Multilevel Interconnection Process", T. Arikado et al., pp. 54-57.
Bredbenner Craig N.
Giniecki Troy A.
Selamoglu Nur
Stocker Hans J.
AT&T Bell Laboratories
Powell William A.
Rehberg John T.
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