Coating processes – With pretreatment of the base – Metal base
Patent
1998-07-16
2000-08-22
Beck, Shrive
Coating processes
With pretreatment of the base
Metal base
427409, 427410, B05D 300
Patent
active
061068993
ABSTRACT:
A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.
REFERENCES:
patent: 3645772 (1972-02-01), Jones
patent: 4428987 (1984-01-01), Bell et al.
patent: 4917758 (1990-04-01), Ishizuka et al.
patent: 5449549 (1995-09-01), Even et al.
patent: 5496590 (1996-03-01), Maki et al.
patent: 5532094 (1996-07-01), Arimura et al.
patent: 5700389 (1997-12-01), Nakagawa
patent: 5744069 (1998-04-01), Maeda et al.
patent: 5773132 (1998-06-01), Blumberg et al.
patent: 5800859 (1998-09-01), Price et al.
Nakagawa Toshiko
Ogushi Ryo
Beck Shrive
Calcagni Jennifer
MEC Company Limited
LandOfFree
Method for surface treatment of copper or copper alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for surface treatment of copper or copper alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for surface treatment of copper or copper alloys will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-578104