Method for surface treatment

Etching a substrate: processes – Nongaseous phase etching of substrate

Reexamination Certificate

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Details

C216S083000, C414S217000, C427S534000, C427S535000, C427S561000, C427S098500, C427S098800, C438S689000

Reexamination Certificate

active

07147795

ABSTRACT:
A method for surface treatment includes: a first step in which a surface treatment apparatus1and a substrate10in a state where a front surface102of the substrate10faces the surface treatment apparatus1are conveyed to the inside of a decompression chamber to decompress a plurality of concave portions32(enclosed spaces); a second step in which the surface treatment apparatus1and the substrate10are brought out from the inside of the decompression chamber to environment under atmospheric pressure in a state where the substrate10is being attracted to the surface treatment apparatus1with the use of a difference between negative pressure inside the concave portions32and atmospheric pressure; and a third step in which the surface treatment is carried out to a back surface101of the substrate10with the substrate10being attracted by the surface treatment apparatus1.

REFERENCES:
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 6517967 (2003-02-01), Shrim et al.
patent: 2003/0077150 (2003-04-01), Matsuda et al.
patent: 2831148 (2003-04-01), None
patent: 07-111257 (1995-04-01), None
Patent Abstracts of Japan re: publication No. 07111257. no date.
Communication from European Patent Office re: related application. no date.

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