Etching a substrate: processes – Nongaseous phase etching of substrate
Reexamination Certificate
2006-12-12
2006-12-12
Norton, Nadine (Department: 1765)
Etching a substrate: processes
Nongaseous phase etching of substrate
C216S083000, C414S217000, C427S534000, C427S535000, C427S561000, C427S098500, C427S098800, C438S689000
Reexamination Certificate
active
07147795
ABSTRACT:
A method for surface treatment includes: a first step in which a surface treatment apparatus1and a substrate10in a state where a front surface102of the substrate10faces the surface treatment apparatus1are conveyed to the inside of a decompression chamber to decompress a plurality of concave portions32(enclosed spaces); a second step in which the surface treatment apparatus1and the substrate10are brought out from the inside of the decompression chamber to environment under atmospheric pressure in a state where the substrate10is being attracted to the surface treatment apparatus1with the use of a difference between negative pressure inside the concave portions32and atmospheric pressure; and a third step in which the surface treatment is carried out to a back surface101of the substrate10with the substrate10being attracted by the surface treatment apparatus1.
REFERENCES:
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patent: 6517967 (2003-02-01), Shrim et al.
patent: 2003/0077150 (2003-04-01), Matsuda et al.
patent: 2831148 (2003-04-01), None
patent: 07-111257 (1995-04-01), None
Patent Abstracts of Japan re: publication No. 07111257. no date.
Communication from European Patent Office re: related application. no date.
Arakawa Katsuji
Koeda Hiroshi
Oya Kazufumi
Angadi Maki
Harness & Dickey & Pierce P.L.C.
Norton Nadine
Seiko Epson Corporation
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