Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2005-09-19
2008-10-07
Le, Thao P. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257S414000
Reexamination Certificate
active
07432572
ABSTRACT:
The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.
REFERENCES:
patent: 4441791 (1984-04-01), Hornbeck
patent: 4566935 (1986-01-01), Hornbeck
patent: 4662746 (1987-05-01), Hornbeck
patent: 4956619 (1990-09-01), Hornbeck
patent: 5312882 (1994-05-01), De Simone et al.
patent: 5382623 (1995-01-01), De Simone et al.
patent: 5451633 (1995-09-01), De Simone et al.
patent: 5496901 (1996-03-01), De Simone
patent: 5505807 (1996-04-01), Min et al.
patent: 5506317 (1996-04-01), De Simone et al.
patent: 5514759 (1996-05-01), De Simone et al.
patent: 5527865 (1996-06-01), De Simone et al.
patent: 5530077 (1996-06-01), De Simone et al.
patent: 5561216 (1996-10-01), De Simone et al.
patent: 5583688 (1996-12-01), Hornbeck et al.
patent: 5589105 (1996-12-01), De Simone et al.
patent: 5618894 (1997-04-01), De Simone et al.
patent: 5639836 (1997-06-01), De Simone et al.
patent: 5672667 (1997-09-01), De Simone et al.
patent: 5674957 (1997-10-01), De Simone et al.
patent: 5679737 (1997-10-01), De Simone et al.
patent: 5688879 (1997-11-01), De Simone
patent: 5739223 (1998-04-01), De Simone
patent: 5766367 (1998-06-01), Smith et al.
patent: 5780553 (1998-07-01), De Simone et al.
patent: 5783082 (1998-07-01), De Simone et al.
patent: 5824726 (1998-10-01), De Simone et al.
patent: 5840820 (1998-11-01), De Simone et al.
patent: 5855819 (1999-01-01), De Simone et al.
patent: 5860467 (1999-01-01), De Simone et al.
patent: 5863612 (1999-01-01), De Simone
patent: 5866005 (1999-02-01), De Simone et al.
patent: 5872157 (1999-02-01), De Simone et al.
patent: 5922833 (1999-07-01), De Simone
patent: 5939501 (1999-08-01), De Simone et al.
patent: 5939502 (1999-08-01), De Simone et al.
patent: 5939785 (1999-08-01), Klonis et al.
patent: 5944996 (1999-08-01), De Simone et al.
patent: 5945477 (1999-08-01), De Simone et al.
patent: 5977292 (1999-11-01), De Simone et al.
patent: 5981673 (1999-11-01), De Simone et al.
patent: 6001418 (1999-12-01), De Simone et al.
patent: 6010542 (2000-01-01), De Young et al.
patent: 6024801 (2000-02-01), Wallace et al.
patent: 6025459 (2000-02-01), De Simone et al.
patent: 6083565 (2000-07-01), Carbonell et al.
patent: 6107443 (2000-08-01), De Simone et al.
patent: 6127000 (2000-10-01), Carbonell et al.
patent: 6147790 (2000-11-01), Meir et al.
patent: 6176895 (2001-01-01), De Simone et al.
patent: 6211422 (2001-04-01), De Simone et al.
patent: 6224774 (2001-05-01), De Simone et al.
patent: 6240936 (2001-06-01), DeSimone et al.
patent: 6242165 (2001-06-01), Vaarstra
patent: 6248136 (2001-06-01), McClain et al.
patent: 6277753 (2001-08-01), Mullee et al.
patent: 6288202 (2001-09-01), De Simone et al.
patent: 6298902 (2001-10-01), DeSimone et al.
patent: 6306564 (2001-10-01), Mullee
patent: 6323982 (2001-11-01), Hornbeck
patent: 6404942 (2002-06-01), Edwards et al.
patent: 6654155 (2003-11-01), Rosa et al.
patent: 6737225 (2004-05-01), Miller
patent: 6806993 (2004-10-01), Adams et al.
patent: 6951769 (2005-10-01), Malone
patent: 6979585 (2005-12-01), Nikkel et al.
patent: 7183637 (2007-02-01), Bruner
patent: 2004/0063325 (2004-04-01), Urano et al.
patent: 2005/0221528 (2005-10-01), Bruner
patent: 2006/0180896 (2006-08-01), Martin et al.
patent: 2006/0183262 (2006-08-01), Freidhoff
Supercritical Carbon-Dioxide Cleaning Technology Review, http://www.pprc.org/pprc/p2tech/co2/co2intro.html (Jul. 1996).
Technical Issue and CO2-Based Cleaning Systems, http://www.pprc.org/pprc/p2tech/co2/co2tech.html (Jul. 1996).
McClain et al., Design of Nonionic Surfactants for Supercritical Carbon Dioxide, Science, vol. 274, (Dec. 1996).
Biberger et al., Photoresist and Photoresist Residue Removal with Supercritical Co2—A Novel Approach to Cleaning Wafers, Semiconductor Fabtech, 12thEdition, (Jul. 2000).
Jafri et al., Critical Point Drying and Cleaning for MEMS Technology, Part of the SPIE Conference on MEMS Reliability for Critical and Space Applications, SPIE, vol. 3880, (Sep. 1999).
Brady III W. James
Le Thao P.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
LandOfFree
Method for stripping sacrificial layer in MEMS assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for stripping sacrificial layer in MEMS assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for stripping sacrificial layer in MEMS assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4008767