Method for stripping sacrificial layer in MEMS assembly

Details Method for stripping sacrificial layer in MEMS assembly Method for stripping sacrificial layer in MEMS assembly

2005-10-04

2005-10-04

Nelms, David (Department: 2829)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S064000, C438S106000, C257S682000, C257S684000

Reexamination Certificate

active

06951769

ABSTRACT:
The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.

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