Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1996-04-22
1999-08-24
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419215, 20419216, 20419222, 20419223, 20419225, 20429803, 20429807, 20429806, 20429808, 20429814, C23C 1434
Patent
active
059420898
ABSTRACT:
A method and apparatus for monitoring and controlling deposition of metal, insulating compounds or other compounds on a substrate by sputtering techniques includes maintaining pulsed, constant, direct current power to the target, sensing the voltage of the target material used in the process, simultaneously rapidly sensing the partial pressure of the reactive gas, and simultaneously biasing the substrate to activate the reactive gas or otherwise energizing the reactive gas in the vicinity of the substrate. An apparatus for practicing the invention is also disclosed.
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Graham Michael E.
Sproul William D.
McDonald Rodney G.
Nguyen Nam
Northwestern University
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