Metal fusion bonding – Process – Plural joints
Patent
1998-08-03
2000-08-01
Mills, Gregory
Metal fusion bonding
Process
Plural joints
228213, 228222, 2282341, B23K 3102, B23K 3500
Patent
active
060954051
ABSTRACT:
Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding block storing portion and cooled. It is then determined whether any other PCB to be soldered exists in the PCB array. If it is determined that any other PCB to be soldered exists in the PCB array, another holding block is picked up from the holding block storing portion and moved to cover an IC on the PCB of the PCB array. The above steps are repeated until all the PCBs of the PCB array to be soldered are completely soldered. If it is determined that any other PCB to be soldered does not exist in the PCB array, the PCB array is transferred to a subsequent process.
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Kim Choul-su
Kim Woo-sik
Tsukue Masaharu
Woo Byung-woo
Bushnell Esq. Robert E.
Johnson Jonathan
Mills Gregory
Samsung Electronics Co,. Ltd.
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