Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1987-10-16
1988-07-26
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228207, 228224, 228226, 228238, 228248, 148 23, B23K 3102, B23K 35363
Patent
active
047594900
ABSTRACT:
A soldering method using a solder paste composed of solder alloy powder and soldering flux comprising rosin, thixotropic agent, activator, organic solvent and azobis compound such as 1,1'-azobis (cyclohexane-1-carbonitrile) as a free radical generator. The 1,1'-azobis (cyclohexane-1-carbonitrile) generates free radicals of cychlohexane-1-carbonitrile when heated in soldering, and the generated free radicals urge the activator to liberate hydrogen halide which enhances a removing effect of oxide film over a metal surface to be soldered. The azobis compound contributes to diminish the amount of activator and, consequently, hydrogen halide in the flux. The viscosity of the solder paste does not vary for a long time, which results in allowing the solder paste have a long shelf life. Since generation of the free radical is not decreased even though a soldering temperature decreased, which results in increasing solderability for low temperature soldering.
REFERENCES:
patent: 4504007 (1985-03-01), Anderson, Jr. et al.
patent: 4650108 (1987-03-01), Gallagher
Fujitsu Limited
Godici Nicholas P.
Heinrich Samuel M.
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