Method for smoothing surface of silicon single crystal substrate

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

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438706, 438734, H01L 21306

Patent

active

060081287

ABSTRACT:
A method for microscopically smoothing a surface of a wafer made of silicon single crystal having a low resistivity. In the method, a native oxide film grown on a surface of a wafer having polished by an ordinary mirror polishing process is removed at a temperature of less than 100.degree. C. with use of a mixture gas of HF and H.sub.2, and then an organic substance deposited thereon is removed at a temperature of less than 800.degree. C. with use of a mixture gas of HCl and H.sub.2. Re-growth of an oxide film is suppressed in a consistent H.sub.2 atmosphere, during which the wafer is substantially not varied in its surface roughness. Then the wafer is thermally treated in an H.sub.2 gas atmosphere at a temperature of not less than 800.degree. C. and less than 1000.degree. C. A process of etching the silicon single crystal substrate and a process of depositing silicon atoms caused by decomposition of a silane compound generated are competitively carried out to thereby soften the microscopic rough surface of the wafer and to improve a smoothness over the smoothness of the mirror-polished surface. Since all process temperatures are set to be less than 1000.degree. C., vaporization of impurities in the wafer can be suppressed and its low resistivity can be secured.

REFERENCES:
patent: 5846321 (1998-12-01), Habuka et al.
patent: 5869387 (1999-02-01), Sato et al.
patent: 5885346 (1999-03-01), Habuka et al.
Journal of Electrochemical Society Habuka, Hitoshi Roughness of Silicon Surface Heated Hydrogen Ambient vol. 142, No. 9 pp. 3092-3098.

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