Method for slicing a multiplicity of wafers from a workpiece

Details Method for slicing a multiplicity of wafers from a workpiece Method for slicing a multiplicity of wafers from a workpiece

2007-12-11

2010-11-09

Rachuba, Maurina (Department: 3727)

Stone working

Sawing

Endless

C451S011000, C451S041000

Reexamination Certificate

active

07827980

ABSTRACT:
A multiplicity of wafers are sliced from a workpiece which has a longitudinal axis and a cross section, the workpiece fastened on a table being fed by a relative movement directed perpendicularly to the longitudinal axis of the workpiece between the table and the wire gang of a wire saw, with a variable forward feed rate through the wire gang formed by a sawing wire moved with an effective speed, the effective speed of the sawing wire being regulated as a function of the forward feed rate and the workpiece cross section so as to result in uniform wear of the sawing wire.

REFERENCES:
patent: 3841297 (1974-10-01), Mech
patent: 4655191 (1987-04-01), Wells et al.
patent: 5771876 (1998-06-01), Egglhuber
patent: 6062209 (2000-05-01), Oishi
patent: 6109253 (2000-08-01), Ikehara
patent: 2010/0006082 (2010-01-01), Glinski et al.
patent: 9262826 (1997-10-01), None

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