Method for single side spray processing of printed circuit board

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156656, 156902, 156345, B44C 122, C23F 100, C03C 1500, C03C 2506

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active

049666479

ABSTRACT:
An apparatus and method for spraying a single side of a printed circuit board with a reactive spray. The apparatus comprises a conveyor table, spray nozzles located below the conveyor table and a protective cover above the conveyor table. The printed circuit boards to be sprayed are sandwiched between the cover and the conveyor table. The cover prevents reactive spray from contacting top sides of the printed circuit boards while also maintaining the boards against the conveyor table such that bottom sides of the boards can be sprayed without risk of reactive spray contacting the top sides of the boards or dislodging the boards from the conveyor table by the upwardly sprayed reactive spray.

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