Method for simultaneously coating a plurality of filaments

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427569, B05D 306

Patent

active

054319684

ABSTRACT:
Methods and apparatuses for coating materials, and the products and compositions produced thereby. Substances, such as diamond or diamond-like carbon, are deposited onto materials, such as a filament or a plurality of filaments simultaneously, using one or more cylindrical, inductively coupled, resonator plasma reactors.

REFERENCES:
patent: 4368092 (1983-01-01), Steinberg et al.
patent: 4402993 (1983-09-01), Aisenberg et al.
patent: 4530750 (1985-07-01), Aisenberg et al.
patent: 4742012 (1988-05-01), Matsumura
patent: 4918031 (1990-04-01), Flamm et al.
Cook, J. M., et al, "Application of a Low-Pressure Radio Frequency Discharge Source to Polysilicon Gate Etching," J. Vacuum Science Technology, B8(1), pp. 1-4 (1990). (No month available).
Rudder, R. A., et al, "Direct Deposition of Polycrystalline Diamond Films on Si(100) Without Surface Pretreatment," Applied Physics Letters, vol. 59, pp. 791-793 (1991). (No month available).
Hsu, W., "Diamond Coatings," Advanced Manufacturing Technologies, Sandia Technology, pp. 10-11 (Mar. 1993).
Advertisement Prototech Research, Inc., the ES-RF Resonator Plasma Source (4 sheets) (No date avail.).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for simultaneously coating a plurality of filaments does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for simultaneously coating a plurality of filaments, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for simultaneously coating a plurality of filaments will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-502102

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.