Method for shielding integrated circuits

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S614000, C438S620000, C438S622000

Reexamination Certificate

active

07732321

ABSTRACT:
A method for adding an additional layer to an integrated circuit, the method including providing an integrated circuit having an interconnect layer, depositing, over substantially all of an exposed surface of the integrated circuit, an additional layer of material whose conductivity can be altered, and selectively altering the conductivity of a first portion of the additional layer by selective annealing, to produce a sub-circuit in the additional layer, the sub-circuit being in operative electrical communication with the integrated circuit. Related apparatus and methods are also described.

REFERENCES:
patent: 4214918 (1980-07-01), Gat et al.
patent: 4339285 (1982-07-01), Pankove
patent: 4583011 (1986-04-01), Pechar
patent: 4766516 (1988-08-01), Ozdemir et al.
patent: 4908226 (1990-03-01), Kubena et al.
patent: 4920402 (1990-04-01), Nakaya et al.
patent: 5336624 (1994-08-01), Walden
patent: 5468990 (1995-11-01), Daum
patent: 5783846 (1998-07-01), Baukus et al.
patent: 5793095 (1998-08-01), Harvey
patent: 5821582 (1998-10-01), Daum
patent: 5824571 (1998-10-01), Rollender et al.
patent: 5866933 (1999-02-01), Baukus et al.
patent: 5883000 (1999-03-01), Pasch
patent: 5930663 (1999-07-01), Baukus et al.
patent: 5973375 (1999-10-01), Baukus et al.
patent: 6064110 (2000-05-01), Baukus et al.
patent: 6117762 (2000-09-01), Baukus et al.
patent: 6294816 (2001-09-01), Baukus et al.
patent: 6360321 (2002-03-01), Gressel et al.
patent: 6495919 (2002-12-01), Farrar
patent: 6496119 (2002-12-01), Otterstedt et al.
patent: 6515304 (2003-02-01), Kash et al.
patent: 6613661 (2003-09-01), Baukus et al.
patent: 6720656 (2004-04-01), Matsumoto
patent: 2001/0033012 (2001-10-01), Kommerling et al.
patent: 2002/0173131 (2002-11-01), Clark, Jr. et al.
patent: 0 585 601 (1994-03-01), None
patent: 0 940 851 (1999-09-01), None
patent: WO 97/29567 (1997-08-01), None
patent: WO 01/50530 (2001-07-01), None
patent: WO 01/54194 (2001-07-01), None
Sonntag et al., “Infineon Introduces Chip Card Controllers for Improved Security of Electronic Identity Cards and Passports” (Infineon Technologies AG, Jul. 7, 2004), available on the World Wide Web at: www.infineon.com/cgi/ecrm.dll/jsp/showfrontend.do?lang=EN&BV—SessionID=@@@@0590998578.1109855404@@@@&BV—EngineID=ccchadddmlfiddkcflgcegndfifdfoh.0&content—type=NEWS&content—oid=107623&news—nav—oid=9979.
Jul. 1, 2009 Office Communication in connection with prosecution of EP 05 740 533.4 (4 pages).

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